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PCA8574/74A
Remote 8-bit I/O expander for I2C-bus with interrupt
Rev. 02 -- 14 May 2007 Product data sheet
1. General description
The PCA8574/74A provide general purpose remote I/O expansion for most microcontroller families via the two-line bidirectional I2C-bus (serial clock (SCL), serial data (SDA)). The devices consist of an 8-bit quasi-bidirectional port and an I2C-bus interface. The PCA8574/74A have low current consumption and include latched outputs with 25 mA high current drive capability for directly driving LEDs. The PCA8574/74A also possess an interrupt line (INT) that can be connected to the interrupt logic of the microcontroller. By sending an interrupt signal on this line, the remote I/O can inform the microcontroller if there is incoming data on its ports without having to communicate via the I2C-bus. The internal Power-On Reset (POR) initializes the I/Os as inputs.
2. Features
I I I I I I I I I I I 400 kHz I2C-bus interface 2.3 V to 5.5 V operation with 5.5 V tolerant I/Os 8-bit remote I/O pins that default to inputs at power-up Latched outputs with 25 mA sink capability for directly driving LEDs Total package sink capability of 200 mA Active LOW open-drain interrupt output 8 programmable slave addresses using 3 address pins Readable device ID (manufacturer, device type, and revision) Low standby current (10 A max.) -40 C to +85 C operation ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per JESD22-A115, and 1000 V CDM per JESD22-C101 I Latch-up testing is done to JEDEC standard JESD78 which exceeds 100 mA I Packages offered: DIP16, SO16, TSSOP16, SSOP20
3. Applications
I I I I I LED signs and displays Servers Industrial control Medical equipment PLCs
NXP Semiconductors
PCA8574/74A
Remote 8-bit I/O expander for I2C-bus with interrupt
I Cellular telephones I Gaming machines I Instrumentation and test measurement
4. Ordering information
Table 1. Ordering information Topside mark PCA8574D PCA8574AD PCA8574N PCA8574AN PCA8574 PA8574A PCA8574 PCA8574A SSOP20 TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm plastic shrink small outline package; 20 leads; body width 4.4 mm SOT403-1 SOT266-1 DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 Package Name SO16 Description plastic small outline package; 16 leads; body width 7.5 mm Version SOT162-1 Type number PCA8574D PCA8574AD PCA8574N PCA8574AN PCA8574PW PCA8574APW PCA8574TS PCA8574ATS
5. Block diagram
PCA8574 PCA8574A
INT AD0 AD1 AD2 SCL SDA INPUT FILTER
INTERRUPT LOGIC
LP FILTER
I2C-BUS CONTROL
SHIFT REGISTER
8 BITS
I/O PORT
P0 to P7
write pulse read pulse VDD VSS POWER-ON RESET
002aac677
Fig 1. Block diagram of PCA8574/74A
PCA8574_PCA8574A_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 14 May 2007
2 of 27
NXP Semiconductors
PCA8574/74A
Remote 8-bit I/O expander for I2C-bus with interrupt
write pulse Itrt(pu) data from Shift Register D FF CI S power-on reset D FF read pulse CI S Q Q
100 A
IOH
VDD
IOL
P0 to P7
VSS
data to Shift Register
002aac109
to interrupt logic
Fig 2. Simplified schematic diagram of P0 to P7
6. Pinning information
6.1 Pinning
PCA8574N PCA8574AN
AD0 AD1 AD2 P0 P1 P2 P3 VSS 1 2 3 4 5 6 7 8
002aac679
16 VDD 15 SDA 14 SCL AD0 13 INT 12 P7 11 P6 10 P5 9 P4 AD1 AD2 P0 P1 P2 P3 VSS 1 2 3 4 5 6 7 8
002aac678
16 VDD 15 SDA 14 SCL 13 INT 12 P7 11 P6 10 P5 9 P4
PCA8574D PCA8574AD
Fig 3. Pin configuration for DIP16
Fig 4. Pin configuration for SO16
PCA8574_PCA8574A_2
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Product data sheet
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3 of 27
NXP Semiconductors
PCA8574/74A
Remote 8-bit I/O expander for I2C-bus with interrupt
INT SCL AD0 AD1 AD2 P0 P1 P2 P3 VSS 1 2 3 4 5 6 7 8
002aac941
1 2 3 4 5 6 7 8 9
20 P7 19 P6 18 n.c. 17 P5 16 P4 15 VSS 14 P3 13 n.c. 12 P2 11 P1
002aac680
16 VDD 15 SDA 14 SCL 13 INT 12 P7 11 P6 10 P5 9 P4
n.c. SDA VDD AD0 AD1 n.c. AD2
PCA8574PW PCA8574APW
PCA8574TS PCA8574ATS
P0 10
Fig 5. Pin configuration for TSSOP16
Fig 6. Pin configuration for SSOP20
6.2 Pin description
Table 2. Symbol AD0 AD1 AD2 P0 P1 P2 P3 VSS P4 P5 P6 P7 INT SCL SDA VDD Pin description for DIP16, SO16, TSSOP16 Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Description address input 0 address input 1 address input 2 quasi-bidirectional I/O 0 quasi-bidirectional I/O 1 quasi-bidirectional I/O 2 quasi-bidirectional I/O 3 supply ground quasi-bidirectional I/O 4 quasi-bidirectional I/O 5 quasi-bidirectional I/O 6 quasi-bidirectional I/O 7 interrupt output (active LOW) serial clock line serial data line supply voltage
PCA8574_PCA8574A_2
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Product data sheet
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4 of 27
NXP Semiconductors
PCA8574/74A
Remote 8-bit I/O expander for I2C-bus with interrupt
Pin description for SSOP20 Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Description interrupt output (active LOW) serial clock line not connected serial data line supply voltage address input 0 address input 1 not connected address input 2 quasi-bidirectional I/O 0 quasi-bidirectional I/O 1 quasi-bidirectional I/O 2 not connected quasi-bidirectional I/O 3 supply ground quasi-bidirectional I/O 4 quasi-bidirectional I/O 5 not connected quasi-bidirectional I/O 6 quasi-bidirectional I/O 7
Table 3. Symbol INT SCL n.c. SDA VDD AD0 AD1 n.c. AD2 P0 P1 P2 n.c. P3 VSS P4 P5 n.c. P6 P7
PCA8574_PCA8574A_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
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5 of 27
NXP Semiconductors
PCA8574/74A
Remote 8-bit I/O expander for I2C-bus with interrupt
7. Functional description
Refer to Figure 1 "Block diagram of PCA8574/74A".
7.1 Device address
Following a START condition, the bus master must send the address of the slave it is accessing and the operation it wants to perform (read or write). The address of the PCA8574/74A is shown in Figure 7. Slave address pins AD2, AD1, and AD0 choose 1 of 8 slave addresses. To conserve power, no internal pull-up resistors are incorporated on AD2, AD1, and AD0. Address values depending on AD2, AD1, and AD0 can be found in Table 4 "PCA8574 address map" and Table 5 "PCA8574A address map". Remark: When using the PCA8574A, the General Call address (0000 0000b) and the Device ID address (1111 100Xb) are reserved and cannot be used as device address. Failure to follow this requirement will cause the PCA8574A not to acknowledge.
slave address A6 A5 A4 A3 A2 A1 A0 R/W
programmable
002aab636
Fig 7. PCA8574/74A address
The last bit of the first byte defines the operation to be performed. When set to logic 1 a read is selected, while a logic 0 selects a write operation. When AD2, AD1 and AD0 are held to VDD or VSS, the same address as the PCF8574 or PCF8574A is applied.
7.1.1 Address maps
Table 4. A6 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 PCA8574 address map A5 A4 0 0 0 0 0 0 0 0 A3 0 0 0 0 0 0 0 0 A2 0 0 0 0 1 1 1 1 A1 0 0 1 1 0 0 1 1 A0 0 1 0 1 0 1 0 1 Address 20h 21h 22h 23h 24h 25h 26h 27h
PCA8574_PCA8574A_2
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Product data sheet
Rev. 02 -- 14 May 2007
6 of 27
NXP Semiconductors
PCA8574/74A
Remote 8-bit I/O expander for I2C-bus with interrupt
PCA8574A address map A5 1 1 1 1 1 1 1 1 A4 1 1 1 1 1 1 1 1 A3 1 1 1 1 1 1 1 1 A2 0 0 0 0 1 1 1 1 A1 0 0 1 1 0 0 1 1 A0 0 1 0 1 0 1 0 1 Address 38h 39h 3Ah 3Bh 3Ch 3Dh 3Eh 3Fh
Table 5. A6 0 0 0 0 0 0 0 0
8. I/O programming
8.1 Quasi-bidirectional I/O architecture
The PCA8574/74A's 8 ports (see Figure 2) are entirely independent and can be used either as input or output ports. Input data is transferred from the ports to the microcontroller in the Read mode (see Figure 9). Output data is transmitted to the ports in the Write mode (see Figure 8). This quasi-bidirectional I/O can be used as an input or output without the use of a control signal for data directions. At power-on the I/Os are HIGH. In this mode only a current source (IOH) to VDD is active. An additional strong pull-up to VDD (Itrt(pu)) allows fast rising edges into heavily loaded outputs. These devices turn on when an output is written HIGH, and are switched off by the negative edge of SCL. The I/Os should be HIGH before being used as inputs. After power-on, as all the I/Os are set HIGH, all of them can be used as inputs. Any change in setting of the I/Os as either inputs or outputs can be done with the write mode. Remark: If a HIGH is applied to an I/O which has been written earlier to LOW, a large current (IOL) will flow to VSS.
8.2 Writing to the port (Output mode)
To write, the master (microcontroller) first addresses the slave device. By setting the last bit of the byte containing the slave address to logic 0 the write mode is entered. The PCA8574/74A acknowledges and the master sends the data byte for P7 to P0 and is acknowledged by the PCA8574/74A. The 8-bit data is presented on the port lines after it has been acknowledged by the PCA8574/74A. The number of data bytes that can be sent successively is not limited. The previous data is overwritten every time a data byte has been sent.
PCA8574_PCA8574A_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 14 May 2007
7 of 27
NXP Semiconductors
PCA8574/74A
Remote 8-bit I/O expander for I2C-bus with interrupt
SCL
1
2
3
4
5
6
7
8
9 data 1 data 2
slave address SDA S A6 A5 A4 A3 A2 A1 A0 0 START condition R/W
A P7 P6 1 P4 P3 P2 P1 P0 A P7 0 P5 P4 P3 P2 P1 P0 A P5 acknowledge from slave P5 acknowledge from slave tv(Q) acknowledge from slave
write to port tv(Q) DATA 1 VALID DATA 2 VALID
data output from port P5 output voltage
P5 pull-up output current INT
Itrt(pu) IOH
td(rst)
002aac120
Fig 8. Write mode (output)
8.3 Reading from a port (Input mode)
All ports programmed as input should be set to logic 1. To read, the master (microcontroller) first addresses the slave device after it receives the interrupt. By setting the last bit of the byte containing the slave address to logic 1 the Read mode is entered. The data bytes that follow on the SDA are the values on the ports. If the data on the input port changes faster than the master can read, this data may be lost.
slave address SDA S A6 A5 A4 A3 A2 A1 A0 1 START condition read from port R/W A
data from port DATA 1 A
data from port DATA 4
no acknowledge from master
1
P STOP condition
acknowledge from slave
acknowledge from master
DATA 2 data into port th(D) INT tv(Q) td(rst) td(rst)
002aac121
DATA 3 tsu(D)
DATA 4
A LOW-to-HIGH transition of SDA while SCL is HIGH is defined as the STOP condition (P). Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present at the last acknowledge phase is valid (Output mode). Input data is lost.
Fig 9. Read input port register
PCA8574_PCA8574A_2
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Product data sheet
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NXP Semiconductors
PCA8574/74A
Remote 8-bit I/O expander for I2C-bus with interrupt
8.4 Power-on reset
When power is applied to VDD, an internal Power-On Reset (POR) holds the PCA8574/74A in a reset condition until VDD has reached VPOR. At that point, the reset condition is released and the PCA8574/74A registers and I2C-bus/SMBus state machine will initialize to their default states. Thereafter VDD must be lowered below 0.2 V to reset the device.
8.5 Interrupt output (INT)
The PCA8574/74A provides an open-drain interrupt (INT) which can be fed to a corresponding input of the microcontroller (see Figure 8, Figure 9, and Figure 10). This gives these chips a kind of master function which can initiate an action elsewhere in the system. An interrupt is generated by any rising or falling edge of the port inputs. After time tv(D) the signal INT is valid. The interrupt disappears when data on the port is changed to the original setting or data is read from or written to the device which has generated the interrupt. In the write mode, the interrupt may become deactivated (HIGH) on the rising edge of the write to port pulse. On the falling edge of the write to port pulse the interrupt is definitely deactivated (HIGH). The interrupt is reset in the read mode on the rising edge of the read from port pulse. During the resetting of the interrupt itself, any changes on the I/Os may not generate an interrupt. After the interrupt is reset any change in I/Os will be detected and transmitted as an INT.
VDD
device 1
device 2
device 8
PCA8574
MICROCOMPUTER INT INT
PCA8574
PCA8574
INT
INT
002aac682
Fig 10. Application of multiple PCA8574s with interrupt
PCA8574_PCA8574A_2
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Product data sheet
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NXP Semiconductors
PCA8574/74A
Remote 8-bit I/O expander for I2C-bus with interrupt
9. Characteristics of the I2C-bus
The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor when connected to the output stages of a device. Data transfer may be initiated only when the bus is not busy.
9.1 Bit transfer
One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse as changes in the data line at this time will be interpreted as control signals (see Figure 11).
SDA
SCL data line stable; data valid change of data allowed
mba607
Fig 11. Bit transfer
9.1.1 START and STOP conditions
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line while the clock is HIGH is defined as the START condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP condition (P) (see Figure 12.)
SDA
SDA
SCL S START condition P STOP condition
SCL
mba608
Fig 12. Definition of START and STOP conditions
9.2 System configuration
A device generating a message is a `transmitter'; a device receiving is the `receiver'. The device that controls the message is the `master' and the devices which are controlled by the master are the `slaves' (see Figure 13).
PCA8574_PCA8574A_2
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Product data sheet
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NXP Semiconductors
PCA8574/74A
Remote 8-bit I/O expander for I2C-bus with interrupt
SDA SCL MASTER TRANSMITTER/ RECEIVER SLAVE RECEIVER SLAVE TRANSMITTER/ RECEIVER MASTER TRANSMITTER MASTER TRANSMITTER/ RECEIVER I2C-BUS MULTIPLEXER
SLAVE
002aaa966
Fig 13. System configuration
9.3 Acknowledge
The number of data bytes transferred between the START and the STOP conditions from transmitter to receiver is not limited. Each byte of eight bits is followed by one acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter, whereas the master generates an extra acknowledge related clock pulse. A slave receiver which is addressed must generate an acknowledge after the reception of each byte. Also a master must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. The device that acknowledges has to pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse; set-up and hold times must be taken into account. A master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this event, the transmitter must leave the data line HIGH to enable the master to generate a STOP condition.
data output by transmitter not acknowledge data output by receiver acknowledge SCL from master S START condition 1 2 8 clock pulse for acknowledgement
002aaa987
9
Fig 14. Acknowledgement on the I2C-bus
PCA8574_PCA8574A_2
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Product data sheet
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NXP Semiconductors
PCA8574/74A
Remote 8-bit I/O expander for I2C-bus with interrupt
10. Application design-in information
10.1 Bidirectional I/O expander applications
In the 8-bit I/O expander application shown in Figure 15, P0 and P1 are inputs, and P2 to P7 are outputs. When used in this configuration, during a write, the input (P0 and P1) must be written as HIGH so the external devices fully control the input ports. The desired HIGH or LOW logic levels may be written to the I/Os used as outputs (P2 to P7). During a read, the logic levels of the external devices driving the input ports (P0 and P1) and the previous written logic level to the output ports (P2 to P7) will be read. The GPIO also has an interrupt line (INT) that can be connected to the interrupt logic of the microprocessor. By sending an interrupt signal on this line, the remote I/O informs the microprocessor that there is incoming data or a change of data on its ports without having to communicate via the I2C-bus.
VDD
VDD VDD
CORE PROCESSOR
SDA SCL INT
AD0 AD1 AD2
P0 P1 P2 P3 P4 P5 P6 P7
temperature sensor battery status control for latch control for switch control for audio control for camera control for MP3
002aac123
Fig 15. Bidirectional I/O expander application
10.2 High current-drive load applications
The GPIO has a maximum sinking current of 25 mA per bit. In applications requiring additional drive, two port pins in the same octal may be connected together to sink up to 50 mA current. Both bits must then always be turned on or off together. Up to 8 pins (one octal) can be connected together to drive 200 mA.
VDD
VDD
VDD
CORE PROCESSOR
SDA SCL INT
AD0 AD1 AD2
P0 P1 P2 P3 P4 P5 P6 P7
LOAD
002aac124
Fig 16. High current-drive load application
PCA8574_PCA8574A_2
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Product data sheet
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NXP Semiconductors
PCA8574/74A
Remote 8-bit I/O expander for I2C-bus with interrupt
11. Limiting values
Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VDD IDD ISS VI II IO Ptot P/out Tstg Tamb
[1]
Parameter supply voltage supply current ground supply current input voltage input current output current total power dissipation power dissipation per output storage temperature ambient temperature
Conditions
Min -0.5 VSS - 0.5 [1]
Max +6 100 400 5.5 20 50 400 100 +150 +85
Unit V mA mA V mA mA mW mW C C
-65
operating
-40
Total package (maximum) output current is 400 mA.
PCA8574_PCA8574A_2
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Product data sheet
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NXP Semiconductors
PCA8574/74A
Remote 8-bit I/O expander for I2C-bus with interrupt
12. Static characteristics
Table 7. Static characteristics VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = -40 C to +85 C; unless otherwise specified. Symbol Supplies VDD IDD supply voltage supply current Operating mode; no load; VI = VDD or VSS; fSCL = 400 kHz; AD0, AD1, AD2 = static H or L Standby mode; no load; VI = VDD or VSS; fSCL = 0 kHz
[1]
Parameter
Conditions
Min 2.3 -
Typ 200
Max 5.5 500
Unit V A
Istb VPOR VIL VIH IOL
standby current power-on reset voltage LOW-level input voltage HIGH-level input voltage LOW-level output current
-0.5 0.7VDD
4.5 1.8 35 44 57 5 26 33 40 -138 -1.0 2.1 2.1 3 3.5
10 2.0 +0.3VDD 5.5 +1 10 200 -300 10 10 5 +0.3VDD 5.5 +1 5
A V V V mA mA mA A pF mA mA mA mA A mA pF pF mA pF V V A pF
Input SCL; input/output SDA
VOL = 0.4 V; VDD = 2.3 V VOL = 0.4 V; VDD = 3.0 V VOL = 0.4 V; VDD = 4.5 V
20 25 30 -1 [2] [2] [2] [2]
IL Ci IOL
leakage current input capacitance LOW-level output current
VI = VDD or VSS VI = VSS VOL = 0.5 V; VDD = 2.3 V VOL = 0.5 V; VDD = 3.0 V VOL = 0.5 V; VDD = 4.5 V
I/Os; P0 to P7 12 17 25 -30 -0.5
[3] [3]
IOL(tot) IOH Itrt(pu) Ci Co IOL Co VIL VIH ILI Ci
[1] [2] [3]
total LOW-level output current HIGH-level output current input capacitance output capacitance LOW-level output current output capacitance LOW-level input voltage HIGH-level input voltage input leakage current input capacitance
VOL = 0.5 V; VDD = 4.5 V VOH = VSS
transient boosted pull-up current VOH = VSS; see Figure 8
3.0 -0.5 0.7VDD -1 -
Interrupt INT (see Figure 8 and Figure 9) VOL = 0.4 V
Inputs AD0, AD1, AD2
The power-on reset circuit resets the I2C-bus logic with VDD < VPOR and sets all I/Os to logic 1 (with current source to VDD). Each bit must be limited to a maximum of 25 mA and the total package limited to 200 mA due to internal busing limits. The value is not tested, but verified on sampling basis.
PCA8574_PCA8574A_2
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Product data sheet
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NXP Semiconductors
PCA8574/74A
Remote 8-bit I/O expander for I2C-bus with interrupt
13. Dynamic characteristics
Table 8. Dynamic characteristics VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = -40 C to +85 C; unless otherwise specified. Limits are for Fast-mode I2C-bus. Symbol fSCL tBUF tHD;STA tSU;STA tSU;STO tHD;DAT tVD;ACK tVD;DAT tSU;DAT tLOW tHIGH tf tr tSP Parameter SCL clock frequency bus free time between a STOP and START condition hold time (repeated) START condition set-up time for a repeated START condition set-up time for STOP condition data hold time data valid acknowledge data valid time[2] data set-up time LOW period of the SCL clock HIGH period of the SCL clock fall time of both SDA and SCL signals rise time of both SDA and SCL signals pulse width of spikes that must be suppressed by the input filter[6] data output valid time data input set-up time data input hold time data input valid time reset delay time
[3][4]
Conditions
Min 0 1.3 0.6 0.6 0.6 0 0.1 50 100 1.3 0.6 20 + 20 + 0.1Cb[5] 0.1Cb[5]
Typ -
Max 400 0.9 300 300 50
Unit kHz s s s s ns s ns ns s s ns ns ns
time[1]
Port timing; CL 100 pF (see Figure 8 and Figure 9) tv(Q) tsu(D) th(D) tv(D) td(rst)
[1] [2] [3] [4]
0 4 -
-
4 4 4
s s s s s
Interrupt timing; CL 100 pF (see Figure 8 and Figure 9)
tVD;ACK = time for Acknowledgement signal from SCL LOW to SDA (out) LOW. tVD;DAT = minimum time for SDA data out to be valid following SCL LOW. A master device must internally provide a hold time of at least 300 ns for the SDA signal (refer to the VIL of the SCL signal) in order to bridge the undefined region SCL's falling edge. The maximum tf for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time for the SDA output stage tf is specified at 250 ns. This allows series protection resistors to be connected between the SDA and the SCL pins and the SDA/SCL bus lines without exceeding the maximum specified tf. Cb = total capacitance of one bus line in pF. Input filters on the SDA and SCL inputs suppress noise spikes less than 50 ns.
[5] [6]
PCA8574_PCA8574A_2
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Product data sheet
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NXP Semiconductors
PCA8574/74A
Remote 8-bit I/O expander for I2C-bus with interrupt
protocol
START condition (S) tSU;STA
bit 7 MSB (A7) tLOW tHIGH
bit 6 (A6)
bit 0 (R/W)
acknowledge (A)
STOP condition (P)
1/f
SCL
SCL tBUF tr tf
SDA
tHD;STA
tSU;DAT
tHD;DAT
tVD;DAT
tVD;ACK
tSU;STO
002aab175
Rise and fall times refer to VIL and VIH.
Fig 17. I2C-bus timing diagram
PCA8574_PCA8574A_2
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Product data sheet
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NXP Semiconductors
PCA8574/74A
Remote 8-bit I/O expander for I2C-bus with interrupt
14. Package outline
DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 16 9 MH wM (e 1)
pin 1 index E
1
8
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.02 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.045 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.1 e1 7.62 0.3 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT38-1 REFERENCES IEC 050G09 JEDEC MO-001 JEITA SC-503-16 EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-13
Fig 18. Package outline SOT38-1 (DIP16)
PCA8574_PCA8574A_2 (c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 14 May 2007
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NXP Semiconductors
PCA8574/74A
Remote 8-bit I/O expander for I2C-bus with interrupt
SO16: plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
D
E
A X
c y HE vMA
Z 16 9
Q A2 A1 pin 1 index Lp L 1 e bp 8 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT162-1 REFERENCES IEC 075E03 JEDEC MS-013 JEITA EUROPEAN PROJECTION A max. 2.65 0.1 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 10.5 10.1 0.41 0.40 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.05 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 Z
(1)
0.9 0.4
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
0.035 0.004 0.016
8o o 0
ISSUE DATE 99-12-27 03-02-19
Fig 19. Package outline SOT162-1 (SO16)
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Product data sheet
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NXP Semiconductors
PCA8574/74A
Remote 8-bit I/O expander for I2C-bus with interrupt
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
D
E
A
X
c y HE vMA
Z
16
9
Q A2 pin 1 index A1 Lp L (A 3) A
1
e bp
8
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 5.1 4.9 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.40 0.06 8 o 0
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT403-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18
Fig 20. Package outline SOT403-1 (TSSOP16)
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Product data sheet
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NXP Semiconductors
PCA8574/74A
Remote 8-bit I/O expander for I2C-bus with interrupt
SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm
SOT266-1
D
E
A X
c y HE vM A
Z
20
11
Q A2 pin 1 index A1 (A 3) Lp L A
1
e bp
10
detail X wM
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.5 A1 0.15 0 A2 1.4 1.2 A3 0.25 bp 0.32 0.20 c 0.20 0.13 D (1) 6.6 6.4 E (1) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.45 Q 0.65 0.45 v 0.2 w 0.13 y 0.1 Z (1) 0.48 0.18 10 o 0
o
Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT266-1 REFERENCES IEC JEDEC MO-152 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
Fig 21. Package outline SOT266-1 (SSOP20)
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Product data sheet
Rev. 02 -- 14 May 2007
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NXP Semiconductors
PCA8574/74A
Remote 8-bit I/O expander for I2C-bus with interrupt
15. Handling information
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be completely safe you must take normal precautions appropriate to handling integrated circuits.
16. Soldering
16.1 Introduction
There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended.
16.2 Through-hole mount packages
16.2.1 Soldering by dipping or by solder wave
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.
16.2.2 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 C and 400 C, contact may be up to 5 seconds.
16.3 Surface mount packages
16.3.1 Reflow soldering
Key characteristics in reflow soldering are:
* Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 22) than a PbSn process, thus reducing the process window
* Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
* Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the
PCA8574_PCA8574A_2
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Product data sheet
Rev. 02 -- 14 May 2007
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NXP Semiconductors
PCA8574/74A
Remote 8-bit I/O expander for I2C-bus with interrupt
packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 9 and 10
Table 9. SnPb eutectic process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 2.5 2.5 Table 10. 235 220 Lead-free process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 1.6 1.6 to 2.5 > 2.5 260 260 250 350 to 2000 260 250 245 > 2000 260 245 245 350 220 220
Package thickness (mm)
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 22.
temperature
maximum peak temperature = MSL limit, damage level
minimum peak temperature = minimum soldering temperature
peak temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 22. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365 "Surface mount reflow soldering description".
PCA8574_PCA8574A_2
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Product data sheet
Rev. 02 -- 14 May 2007
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NXP Semiconductors
PCA8574/74A
Remote 8-bit I/O expander for I2C-bus with interrupt
16.3.2 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
* Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
* For packages with leads on two sides and a pitch (e):
- larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end.
* For packages with leads on four sides, the footprint must be placed at a 45 angle to
the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
16.3.3 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 C and 320 C.
16.4 Package related soldering information
Table 11. Mounting Through-hole mount Through-hole-surface mount Suitability of IC packages for wave, reflow and dipping soldering methods Package[1] CPGA, HCPGA DBS, DIP, HDIP, RDBS, SDIP, SIL PMFP[4] Soldering method Wave suitable suitable[3] not suitable Reflow[2] - - not suitable Dipping - suitable -
PCA8574_PCA8574A_2
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Product data sheet
Rev. 02 -- 14 May 2007
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PCA8574/74A
Remote 8-bit I/O expander for I2C-bus with interrupt
Table 11. Mounting
Suitability of IC packages for wave, reflow and dipping soldering methods ...continued Package[1] HTSSON..T[5], Soldering method Wave Reflow[2] suitable Dipping -
Surface mount
not suitable BGA, LBGA, LFBGA, SQFP, SSOP..T[5], TFBGA, VFBGA, XSON DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC[7], SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP CWQCCN..L[10], WQCCN..L[10] not suitable[6]
suitable
-
suitable not not recommended[7][8] recommended[9]
suitable suitable suitable not suitable
- - - -
not suitable
[1] [2]
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your NXP Semiconductors sales office. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. Hot bar soldering or manual soldering is suitable for PMFP packages. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[3] [4] [5]
[6]
[7] [8] [9]
[10] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request.
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Product data sheet
Rev. 02 -- 14 May 2007
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NXP Semiconductors
PCA8574/74A
Remote 8-bit I/O expander for I2C-bus with interrupt
17. Abbreviations
Table 12. Acronym CDM CMOS ESD GPIO HBM LED IC I2C-bus ID LSB MM MSB PLC PWM RAID SMBus Abbreviations Description Charged Device Model Complementary Metal Oxide Semiconductor ElectroStatic Discharge General Purpose Input/Output Human Body Model Light Emitting Diode Integrated Circuit Inter-Integrated Circuit bus Identification Least Significant Bit Machine Model Most Significant Bit Programmable Logic Controller Pulse Width Modulation Redundant Array of Independent Disks System Management Bus
18. Revision history
Table 13. Revision history Release date 20070514 Data sheet status Product data sheet Change notice Supersedes PCA8574_PCA8574A_1 Document ID PCA8574_PCA8574A_2 Modifications:
* * * * * *
Section 2 "Features", last bullet item: changed "TSSOP20" to "TSSOP16" Table 1 "Ordering information": changed package from TSSOP20 (SOT360-1) to TSSOP16 (SOT403-1) Section 6.1 "Pinning": deleted pin configuration for TSSOP20; added pin configuration for TSSOP16 Table 2 title changed (added TSSOP16) Table 3 title changed (deleted TSSOP20) Section 14 "Package outline": changed package from TSSOP20 (SOT360-1) to TSSOP16 (SOT403-1) Product data sheet -
PCA8574_PCA8574A_1
20070117
PCA8574_PCA8574A_2
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Product data sheet
Rev. 02 -- 14 May 2007
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NXP Semiconductors
PCA8574/74A
Remote 8-bit I/O expander for I2C-bus with interrupt
19. Legal information
19.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
19.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
19.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to
19.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus -- logo is a trademark of NXP B.V.
20. Contact information
For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com
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(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 14 May 2007
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NXP Semiconductors
PCA8574/74A
Remote 8-bit I/O expander for I2C-bus with interrupt
21. Contents
1 2 3 4 5 6 6.1 6.2 7 7.1 7.1.1 8 8.1 8.2 8.3 8.4 8.5 9 9.1 9.1.1 9.2 9.3 10 10.1 10.2 11 12 13 14 15 16 16.1 16.2 16.2.1 16.2.2 16.3 16.3.1 16.3.2 16.3.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 6 Device address . . . . . . . . . . . . . . . . . . . . . . . . . 6 Address maps. . . . . . . . . . . . . . . . . . . . . . . . . . 6 I/O programming . . . . . . . . . . . . . . . . . . . . . . . . 7 Quasi-bidirectional I/O architecture . . . . . . . . . 7 Writing to the port (Output mode) . . . . . . . . . . . 7 Reading from a port (Input mode) . . . . . . . . . . 8 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 9 Interrupt output (INT) . . . . . . . . . . . . . . . . . . . . 9 Characteristics of the I2C-bus. . . . . . . . . . . . . 10 Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 START and STOP conditions . . . . . . . . . . . . . 10 System configuration . . . . . . . . . . . . . . . . . . . 10 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 11 Application design-in information . . . . . . . . . 12 Bidirectional I/O expander applications . . . . . 12 High current-drive load applications . . . . . . . . 12 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 13 Static characteristics. . . . . . . . . . . . . . . . . . . . 14 Dynamic characteristics . . . . . . . . . . . . . . . . . 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17 Handling information. . . . . . . . . . . . . . . . . . . . 21 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Through-hole mount packages . . . . . . . . . . . . 21 Soldering by dipping or by solder wave . . . . . 21 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 21 Surface mount packages . . . . . . . . . . . . . . . . 21 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 21 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 23 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 23 Package related soldering information . . . . . . 23 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 25 19 19.1 19.2 19.3 19.4 20 21 Legal information . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 26 26 26 26 26 27
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 14 May 2007 Document identifier: PCA8574_PCA8574A_2

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